rm & rmr construction rm series rmr series 1. rm series (raised actuator) and rmr series (recessed actuator) available for different purposes. 2. low contact resistance, and self-clean on contact area. 3. gold plated electrical contact and terminal plating by gold give excellent results when soldering. 4. double contacts offer high reliability. 5. all materials are ul94v-0 grade fire retardant plastics. item description materials treatment 1 actuator ul94v-0 nylon molded white 2 cover ul94v-0 nylon molded black 3 base ul94v-0 nylon molded black 4 contact beryllium copper gold plated at contact area 5 terminal brass gold plated at contact area rm series p.c.b. layout circuit diagram
model prod no. no. of pos dim a rm/rmr-01 01 3.48 0.137 rm/rmr-02 02 6.02 0.237 rm/rmr-03 03 8.56 0.337 rm/rmr-04 04 11.1 0.437 rm/rmr-05 05 13.64 0.537 rm/rmr-06 06 16.18 0.637 rm/rmr-07 07 18.72 0.737 rm/rmr-08 08 21.26 0.837 rm/rmr-09 09 23.8 0.937 rm/rmr-10 10 26.34 1.037 rm/rmr-12 12 31.42 1.237 how to order example: rmr-08g-t is a surface mounting type dip switch, recessed actuator 8 position, with, top tape sealed. terminal type tape & reel packing (per eia standards) for packing details, please refer to pages 13 specification electrical electrical life: 2000 operation cycles per switch 24vdc, 25ma. non-switching rating: 100ma, 50 vdc switching rating: 25ma, 24vcd. contact resistance: (a) 50m ? ? ?
packing all dip switches are shipped in standard ic tubes or tape & reel package with all poles in the "off" position. carrier tape packing part no . no. of pos a b c q'ty/reel rmr-02g-t-r 02 6.50 5.5 16 800 pcs rmr-03g-t-r 03 9.00 7.5 16 800 pcs rmr-04g-t-r 04 11.50 11.5 24 800 pcs rmr-05g-t-r 05 14.10 11.5 24 800 pcs rmr-06g-t-r 06 16.60 14.2 32 800 pcs rmr-07g-t-r 07 19.10 14.2 32 800 pcs rmr-08g-t-r 08 21.70 14.2 32 800 pcs rmr-09g-t-r 09 24.20 20.2 44 800 pcs rmr-10g-t-r 10 26.70 20.2 44 800 pcs rmr-12g-t-r 12 31.90 20.2 44 800 pcs for best results, please follow these recommendations: keep all switch contacts in their "off" position for all operations. soldering: vapor phase & ir-reflow soldering can be applied. cleaning process: flux clean using force rinse, high agitation or triple bath cleaning method. freon tf or te give excellent results. when vapor methods are used, do not subject the switch to solvents at temperatures above 125 f (51 c). reflow temperature profile. (reference) carrier tape packing soldering and cleaning processes
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